Precision cutting for microelectronics
Diamond dicing (sometimes called high speed diamond sawing) is used for precision cutting of hard and brittle materials in the microelectronics industry. We provide high tolerance dicing and sawing services for customer-provided materials like glass, quartz, and ceramics. We can obtain torences as tight as +/-5um while cutting slots and part outlines to imaged features on various substrates up to 180mm square. Finished parts can be packaged into waffle trays, Gel-Pak containers, or tape with our pick-and-place equipment.
With Photo Solutions’ diamond dicing, you can achieve high-speed diamond sawing on glass, quartz, and ceramic substances. We also do precision dicing of customer material up to a 7” square.