High Speed Diamond Dicing Services: Precision Cutting for Microelectronics
Diamond dicing (sometimes called high speed diamond dicing or sawing) is used for precision cutting of hard and brittle materials in the microelectronics industry. We work with customer specifications to provide high quality diamond dicing services for a variety of applications. Contact us for more info or a quote.
Precise Diamond Dicing
We provide high tolerance dicing and sawing services for customer-provided materials like glass, quartz, and ceramics. We can obtain tolerances as tight as +/-5um while cutting slots and part outlines to imaged features on various substrates up to 180mm square. Finished parts can be packaged into waffle trays, Gel-Pak containers, or tape with our pick-and-place equipment.
With Photo Solutions’ diamond dicing, you can achieve high-speed diamond sawing on glass, quartz, and ceramic substances. We also do precision dicing of customer material up to a 7” square.
Laser Machining Services
In addition to our high speed diamond dicing, we also provide laser machining services. For these, we use a high accuracy laser for cutting on polyester and other plastics. We work closely with customers to cut patterns or features of their specifications onto customer-provided materials. Photo Solutions can also provide finished parts with peel away protected tabbed liners with Kiss-Cut capability.
High Speed Diamond Dicing Process
We keep our process simple and use only the highest quality materials and the latest practices.
- Customer provides the drawings or files
- We review the drawings and provide a quote
- Customer provides the material
- We turnaround the finished project in about 1-2 weeks
- We ship the material back to the customer
Trust Photo Solutions With Your High Speed Diamond Dicing
Whatever your industry or application, Photo Solutions’ diamond dicing services are competitively priced and offered with a quick turnaround. Get a quote for your next project!