Diamond Dicing

Red diamond dicing saw

Precision cutting for microelectronics

Diamond dicing (sometimes called high speed diamond sawing) is used for precision cutting of hard and brittle materials in the microelectronics industry. We provide high tolerance dicing and sawing services for customer-provided materials like glass, quartz, and ceramics. We can obtain torences as tight as +/-5um while cutting slots and part outlines to imaged features on various substrates up to 180mm square. Finished parts can be packaged into waffle trays, Gel-Pak containers, or tape with our pick-and-place equipment.

With Photo Solutions’ diamond dicing, you can achieve high-speed diamond sawing on glass, quartz, and ceramic substances. We also do precision dicing of customer material up to a 7” square.

Other Services

Microlithography

Micromachining

Mylar discs and scales

Laser Cutting

Microlithography for discs

Microlithography

Microlithography at Photo Solutions

Microlithography

Auris logo
BEI sensors logo
broadcom logo, photonic engineering
celera motion logo
encoder products co logo, photonic engineering
general dynamics logo
google logo, robotics
honeywell logo, optical encoder discs
intuitive surgical logo, photonic engineering page
Nidec logo, optical encoder discs
nike logo, optical encoder discs
rockwell collins logo, optical encoder discs
velodyne lidar logo, photonic engineering

CALL US FOR A FREE QUOTE